PLASTIC Datasheet(PDF) - CAX100 - NXP Semiconductors

Producent	Numer części	Arkusz danych	Szczegółowy opis
NXP Semiconductors	CAX100	16Kb/1P	Plastic Collimator Lens 1999-07-13
	SOT353	13Kb/1P	Plastic surface-mounted package; 5 leads 21 March 2006
	SOT143B	9Kb/1P	Plastic surface mounted package; 4 leads 29 November 2004
	SOT343N	13Kb/1P	Plastic surface mounted package; 4 leads 1999 Apr 16
	SOT389-1	14Kb/1P	Plastic Low Profile Quad flat Package 2002 Jun 07
	SOT117-1	9Kb/1P	DIP28: plastic dual in-line package; 28 leads (600 mil) 2003 Feb 18
	SOT108-1	10Kb/1P	SO14: plastic small outline package; 14 leads; body width 3.9 mm 2003 Mar 24
	SOT340-1	11Kb/1P	SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm 2003 Mar 24
	SOT765-1	13Kb/1P	plastic very thin shrink small outline package; 8 leads; body width 2.3 mm 2002 Jun 07
	PSMN005-75P	271Kb/13P	N-channel logic level field-effect power transistor in a plastic package using TrenchMOS technology. Rev. 01-26 April 2002
	BZB84-C5V1215	90Kb/14P	General-purpose Zener diodes in a SOT23 (TO-236AB) small Surface-Mounted Device (SMD) plastic package Rev. 03-9 June 2009
	PHB191NQ06LT	91Kb/13P	Logic level N-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS technology Rev. 01-05 May 2004
	SOT926-1	239Kb/1P	plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm 2009
	PH1955L	77Kb/12P	Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. Rev. 01-15 August 2005
	NZH3V0B-115	112Kb/9P	General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package Rev. 01-27 January 2010
	NZH5V1B-115	112Kb/9P	General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package Rev. 01-27 January 2010
	SOT545-3	15Kb/1P	plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad 2004 Feb 05
	BFU725FN1-115	80Kb/11P	NPN silicon germanium microwave transistor for high speed, low noise applications in a plastic, 4-pin dual-emitter SOT343F package Rev. 01-13 July 2009
	BUK7520-55A	318Kb/15P	N-channel enhancement mode field-effect power transistor in a plastic package using TrenchMOS technology, featuring very low on-state resistance. Rev. 01-18 January 2001
	BAT721-215	82Kb/11P	Planar Schottky barrier diodes with an integrated guard ring for stress protection. Encapsulated in small Surface-Mounted Device (SMD) plastic packages. Rev. 06-21 December 2006

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